近期论文及专利 |
[1] A tube-shaped solid–liquid-interfaced triboelectric–electromagnetic hybrid nanogenerator for efficient ocean wave energy harvesting, Xin Sun, Chenjing Shang, Haoxiang Ma, Changzheng Li, Liang Xue, Qingyue Xu, Zihong Wei, Wanli Li*, Yaxiaer Yalikun, Ying-Chih Lai*, Yang Yang*, Nano Energy, 2022, 100, 107540. [2] Lingying Li, Wanli Li*, Xuying Liu, Mizuki Tenjimbayashi, Hiroyo Segawa, Chisato Niikura, Tomonobu Nakayama*, Takeo Minari*, Microflow Manipulation by Velocity Field Gradient: Spontaneous Patterning of Silver Nanowires for Tailored Flexible Transparent Conductors, Advanced Materials Technologies, 2022, 7, 2101687. [3] Wanli Li*, Fengpei Lang, Cheng Liang, Ke Tong, Yang Yang*, Jinting Jiu, Jie Zhang, Hao Wang, Katsuaki Suganuma, Supersaturated solid-solution interfaces of Cu core/Ag shell structures with enhanced thermal stability and oxidation resistance, Corrosion Science, 2022, 201, 110269. [4] Wanli Li,* Lingying Li, Fei Li, Kohsaku Kawakami, Qingqing Sun, Tomonobu Nakayama, Xuying Liu, Masayuki Kanehara, Jie Zhang, and Takeo Minari*，Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics, ACS Applied Materials & Interfaces, 2022, 14, 6, 8146–8156. [5] Lingying Li, Wanli Li*, Qingqing Sun, Xuying Liu, Jinting Jiu, Mizuki Tenjimbayashi, Masayuki Kanehara, Tomonobu Nakayama*, Takeo Minari*, Dual Surface Architectonics for Directed Self-Assembly of Ultrahigh-Resolution Electronics, Small, 2021, 17, 2170129. [6] Wanli Li, Lingying Li, Qingqing Sun, Xuying Liu*, Masayuki Kanehara, Tomonobu Nakayama, Jinting Jiu, Kenji Sakamoto, Takeo Minari*，Direct fabrication of high-resolution and high-performance flexible electronics via surface-activation-localized electroless plating, Chemical Engineering Journal, 2021, 416, 127644. [7] Lingying Li, Wanli Li*, Ke Tong, Jinting Jiu*, Katsuaki Suganuma, Intense pulsed light-induced structure-transformed ultrathin Ni shell for improving the chemical, thermal, and electrical reliability of metal nanowire electrodes without transmittance loss, Chemical Engineering Journal, 2020, 390, 124517. [8] Yang Yang, Sai Chen, Wanli Li, Peng Li,* Jiangang Ma,* Bingsheng Li, Xiaoning Zhao, Zhongshi Ju, Huicong Chang, Lin Xiao, Haiyang Xu, and Yichun Liu, Reduced graphene oxide conformally wrapped silver nanowire networks for flexible transparent heating and electromagnetic interference shielding, ACS Nano 2020, 14, 7, 8754-8765. [9] Wanli Li*, Qingqing Sun, Lingying Li, Jinting Jiu, Xu-Ying Liu, Masayuki Kanehara, Takeo Minari*, Katsuaki Suganuma, The rise of conductive copper inks: challenges and perspectives, Applied materials today, 2020,18, 100451. [10] Bowen Zhang, Chuantong Chen, Wanli Li*, Jeyun Yeom, Katsuaki Suganuma*, Well-Controlled Decomposition of Copper Complex Inks Enabled by Metal Nanowire Networks for Highly Compact, Conductive, and Flexible Copper Films, Advanced Materials Interfaces, 2019, 7, 1901550. [11] Bowen Zhang, Wanli Li*, Masaya Nogi, Chuantong Chen, Yang Yang, Tohru Sugahara, Hirotaka Koga, and Katsuaki Suganuma*, Alloying and embedding of Cu-core/Ag-shell nanowires for ultra-stable stretchable and transparent electrodes, ACS Appl. Mater. Interfaces, 2019, 11(20), 18540-18547. [12] Wanli Li*, Yang Yang, Bowen Zhang, Lingying Li, Guiming Liu, Cai-Fu Li,* Jinting Jiu,* and Katsuaki Suganuma, Three-dimensional stretchable and transparent conductors with controllable strain-distribution based on template-assisted transfer printing, ACS Applied Materials & Interfaces, 2019, 11(2), 2140-2148. [13] Wanli Li*, Yang Yang, Bowen Zhang, Cai-Fu Li, Jinting Jiu,* Katsuaki Suganuma, Highly densified Cu wirings fabricated from air-stable Cu complex ink with high conductivity, enhanced oxidation resistance, and flexibility, Advanced materials interface, 2018, 5, 1800798. [14] Wanli Li*, Cai-Fu Li, Jinting Jiu*, Minoru Ueshima, Zhi-Quan Liu and Katsuaki Suganuma, Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-based tracks at a low temperature below 100 °C, Nanoscale, 2018, 10(11), 5254-5263. [15] Wanli Li*, Lingying Li, Yue Gao, Dawei Hu, Cai-Fu Li, Hao Zhang, Jinting Jiu,* Shijo Nagao and Katsuaki Suganuma, Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: microstructure, resistivity, oxidation resistance, and long-term stability, Journal of Alloys and Compounds, 2018, 732, 240-247. [16] Wanli Li*, Dawei Hu, Lingying Li, Cai-Fu Li, Jinting Jiu,* Chuantong Chen, Toshiyuki Ishina, Tohru Sugahara and Katsuaki Suganuma, Printable and flexible copper-silver alloy electrodes with high conductivity and ultrahigh oxidation resistance, ACS Applied Materials & Interfaces, 2017, 9(29), 24711-24721. [17] Wanli Li*, Hao Zhang, Yue Gao, Jinting Jiu,* Cai-fu Li, Chuantong Chen, Dawei Hu, Yusuke Goya, Yutao Wang, Hirotaka Koga, Shijo Nagao and Katsuaki Suganuma, Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement, Journal of Materials Chemistry C, 2017, 5(5), 1155-1164. [18] Wanli Li*, Shuren Cong, Jinting Jiu,* Shijo Nagao and Katsuaki Suganuma, Self-reducible copper inks composed of copper-amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate, Journal of Materials Chemistry C, 2016, 4(37), 8802-8809. [19] 李万里，三成刚生，銅ニッケル合金電極用導電性インク、銅ニッケル合金電極付基板、および、それらの製造方法，受付番号：JP52102489473。 [20] 三成刚生，刘旭影，孙晴晴，李万里，金属配線を形成する方法，公开号：JPWO2020175170 (A1)，CN113454757 (A)， KR20210100125 (A) 。 [21] 二瓶瑞久，菅沼克昭，李万里，李财富，张昊，一种电路板，授权号：CN108135079 （B）。 [22] 関口卓也，菅沼克昭，李万里，陈传彤，金属製部材の接合方法、金属製部材接合体及び回路基板，公开号：JP2020193318（A），WO2020071471 (A1)。 [23] 菅沼克昭，李万里，配線作製方法，公开号：JP2018152225 (A)。 [24] 酒金婷，上岛稔，菅沼克昭，李万里，METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART，授权号：CN111032912 (B)，US11217359 (B2)，JP6499385 (B1)，KR102163511 (B1)，TWI668709 (B)。 [25] 梅云辉，李万里，陆国权，李欣，铜-铝异种金属快速连接方法, 授权号：ZL201310467634.3。 [26] 梅云辉，李万里，陆国权，李欣, 一种无压烧结连接大功率GTO模块的方法，授权号：ZL201410470189.0。 |
